SS700(9B) single sided (lapping) polishing machine

keyword:

研磨


Diversified processing products and customized equipment functions

Rotating tools:

Number of carriers:

Working Size example:

Plates rotation speed:

Gear rotation speed:

Installed electrical power:

Voltage:

Specification of machine:

Weight:

680mm

Long combination

3 wafers 8″,6 wafers 4″

0-200tr/min

0-40tr/min

8kw

380V three-phase

W1350*D1110*H2030

1800kg



category:

  • Description
  • Examples
  • Application
    • Commodity name: SS700(9B) single sided (lapping) polishing machine
    • Rotating tools:: 680mm
    • Number of carriers:: Long combination
    • Working Size example:: 3 wafers 8″,6 wafers 4″
    • Plates rotation speed:: 0-200tr/min
    • Gear rotation speed:: 0-40tr/min
    • Installed electrical power:: 8kw
    • Voltage:: 380V three-phase
    • Specification of machine:: W1350*D1110*H2030
    • Weight:: 1800kg

    Diversified processing products and customized equipment functions

    Product features

    1.Customize cylinder polishing head(parts support).
    2. There is 3 distinguish motions with independent motorisation..
    3. It can process products of different specifications and models at the same time.
    4. Cooling system of polishing disc.
    5. Vacuum system can fix the parts on the heads.
    6.The polishing liquid drop type can effectively control the cost, and each opening and closing time can be set to 0.01 seconds.
    7. Waste liquid discharge: control the waste liquid discharge of polishing liquid.
    8. Operate the control panel. The system includes: manual system/automatic system.
    9. Different customers can provide process support and technical support.

     

    Equipment parameters

    Specifications SS700
    Bowl size 700mm
    Rotating tools 680mm
    Working Size example 3 wafers 8″
    6 wafers 4″
    Plates rotation speed 0-200tr/min
    Arm slew rate 0-40tr/min
    Plates motor power 5.5kw
    Arm motor power 0.9kw
    Installed electrical power 8kw
    Voltage 380V  three-phase
    Specification of machine W1350*D1110*H2030
    Weight 1800kg
    Production cycle 6 months
    Key words:
    • polishing
    • SS700
    • lapping
  • Processing material range:

    Fluoride, zinc selenide, zinc sulfide, lithium niobate, lithium carbonate, germanium, silicon and other crystals, ceramics, sapphire, infrared, semiconductor, laser, metal, precision optical devices and ordinary glass......

              

    Application:

    Military industry, aerospace, electronics, semiconductor, laser navigation, machinery, medical treatment, optics, high-end watch manufacturing......