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Double-sided (lapping) polishing machine DS280

keyword：

研磨

Small desktop high-precision, high-speed, high-power double-sided lapping/polishing machine

Rotating tools：

Number of carriers：

Max.Working Size：

Plates rotation speed：

Gear rotation speed：

Installed electrical power：

Voltage：

Specification of machine：

Weight：

230mm

6 pieces

Ø2 inches; thickness 21 mm

0-250tr/min

0-54tr/min

0.8kw

220V single-phase electricity

W640*D380*H660

150kg

category：

DS280

Description
Examples
Application

Commodity name: Double-sided (lapping) polishing machine DS280
Rotating tools：: 230mm
Number of carriers：: 6 pieces
Max.Working Size：: Ø2 inches; thickness 21 mm
Plates rotation speed：: 0-250tr/min
Gear rotation speed：: 0-54tr/min
Installed electrical power：: 0.8kw
Voltage：: 220V single-phase electricity
Specification of machine：: W640*D380*H660
Weight：: 150kg

Small desktop high-precision, high-speed, high-power double-sided lapping/polishing machine

Product Features:

Small, high-precision, high-speed, high-power double-sided lapping machine / Polishing all-in-one desktop machine, a compact, benchtop precision machining device, is a groundbreaking lapping and polishing system.

Can be used in laboratories: Compact size: A benchtop model that occupies minimal floor space, features simple operation, and can be placed directly in a laboratory setting—without concerns about water, electricity, gas, or waste‑liquid disposal.

Can be offered to manufacturing enterprises: Flexible configuration: it can be used for small‑scale R&D on a single unit, or scaled up with multiple units in parallel for mass production; it can also be integrated with a single‑sided polishing machine to form a production line, enabling one‑step lapping. ‑ Polishing ‑ CMP and also The entire repair process.

Touchscreen CNC control allows programmable storage of process parameters such as spindle speed, rotation direction, processing time, and polishing fluid. It features a low operational learning curve, high process compatibility, and is ideal for batch production of precision optical crystals and semiconductor substrates, with a particular focus on high-precision double-sided machining of small‑size workpieces.

Simultaneous high-speed lapping and polishing of both the top and bottom surfaces ensures the stability and uniformity of the machined parts, boosts yield rates, streamlines the manufacturing process, reduces processing costs, and eliminates reliance on specialized technical expertise.

Device Parameters

Specifications	DS280
Bowl size	280mm
Rotating tools	230mm
Carriers track net	6 pcs * Ø70 mm
Max. Working Size	Ø2 inches; th 21mm
Plates rotation speed	0-250tr/min
Gear rotation speed	0-54tr/min
Plates motor power	0.6kw
Installed electrical power	0.8kw
Voltage	220V
Dimension	W640D380H660mm
Weight	150kg

Key words:

Polishing machine
equipment
power
rotational speed
motor
gear
specifications
grinding
polishing disc

MgF2 Specifications Ø38*th5 Parallelism after machining 0.2~0.8S

ID card Specification 8*8*th5 After processing Photovoltaic ： 1/10 lambda
Main material processing range for customers:
Fluorides, zinc selenide, zinc sulfide, lithium niobate, germanium, silicon, sapphire, various laser crystals, ceramics, infrared materials, optical glass, semiconductor materials, and other soft, hard, and brittle substances.

Mainly used for:
Military industry, aerospace, electronics, semiconductors, laser navigation, machinery, medical devices, optics, and high-end watch manufacturing...