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Double-sided (grinding) polishing machine DS1700

keyword：

研磨

Rotating tools：

Number of carriers：

Max.Working Size：

Plates rotation speed：

Gear rotation speed：

Installed electrical power：

Voltage：

Specification of machine：

Weight：

1600mm

6 pieces

Ø480*th100 mm

0-50 tr/min

0-8 tr/min

80KW

3-phase 380V

1.9*2.8*H3.5 m

12T

category：

Double sided (lapping) polishing machine

DS1700

Description
Examples
Application

Commodity name: Double-sided (grinding) polishing machine DS1700
Rotating tools：: 1600mm
Number of carriers：: 6 pieces
Max.Working Size：: Ø480*th100 mm
Plates rotation speed：: 0-50 tr/min
Gear rotation speed：: 0-8 tr/min
Installed electrical power：: 80KW
Voltage：: 3-phase 380V
Specification of machine：: 1.9*2.8*H3.5 m
Weight：: 12T

Product positioning

Ultra-large-scale mass-production double-sided grinding machine / Polished flagship model, DS The flagship model in the series is designed for high‑volume, double‑sided precision machining of large‑diameter wafers and oversized optical substrates. It is ideally suited for continuous mass production on semiconductor fabs and large‑scale optical manufacturing lines, while also supporting ultra‑high‑precision prototype development.

Product Features

Five motors independently control different mechanisms, driving the upper plate, lower plate, and central gear. ‑ Compound drive with an internal gear ring, programmable planetary motion trajectory; addresses the challenge of machining uniformity for large‑size workpieces, delivering excellent flatness consistency across large‑area disk surfaces; polishing disc. By employing a specially customized corrosion-resistant metal plate, we effectively circumvent the unique processing requirements of semiconductor materials and… CMP Requirements for the corrosion resistance of the process.

Closed-loop servo‑controlled pressurization system, oversized upper platen cylinder assembly, segmented pressure control for precise regulation, and fine adjustment of rotational speed and polishing‑fluid flow rate.

The entire machine features a full‑surface water‑cooling constant‑temperature circulation system, ensuring minimal temperature drift even during prolonged continuous operation on the large work surface, making it ideal for… 7 × 24 Hourly, continuous mass production.

High-capacity, multi-channel independent polishing‑slurry delivery ensures precise supply; multi‑pipe, zone‑based spraying allows for individual adjustment of flow rates across different areas, accommodating process variations at various locations on large‑diameter wafers.

Large touch screen PLC Control system capable of storing hundreds of proven process recipes, supporting production data recording and export, and compatible with factory environments. MES Docking; equipped with multiple safety interlocks and a safety protective enclosure door.

Extensive optional features: online thickness monitoring system, automated loading and unloading mechanisms, automatic plate‑repair unit, high‑precision micro‑pressure regulation, centralized waste‑liquid treatment system, and more; a fully customized automated production line is available.

Specifications	DS 1700
Equipment polishing outer diameter Bowl size	1700mm
Polishing disc size Rotating tools	1600mm
Parade wheel trajectory network Carriers track net Ø	6 pcs* Ø 515 mm
Maximum machining size Max. Working Size	Ø 480*th100 mm
Polishing disc rotational speed Plates rotation speed	0–50 rpm
External gear rotational speed Outer gear rotation speed	0-8 rpm
Internal gear rotational speed Inner gear rotation speed	0–50 rpm
Installed power rating Installed electrical power	80 kw
Power supply voltage Voltage	3*380 V
Device Specifications Dimension	1.92.8H3.5 m
Equipment weight Weight	12 T

Processable materials
Silicon carbide, silicon wafers, sapphire, various laser crystals, fluorides, zinc selenide, zinc sulfide, germanium, lithium niobate, various optical glasses, aluminum oxide / Beryllium oxide ceramics, various infrared substrates, special alloys, and other precision materials of diverse hard‑and‑brittle types and sizes.
Application scenarios
12 Inch‑scale semiconductor substrates, large‑size optical windows, aerospace‑grade oversized components, military‑grade large optical elements, and high‑end medical components—catering to large‑scale, factory‑based double‑sided polishing production lines.