Double-sided (lapping) polishing machine DS1700
keyword：
研磨
Polishing disc outer diameter:
Number of parade floats:
Maximum machining size:
Polishing pad speed:
External gear rotational speed:
Internal gear rotational speed:
Installed power rating:
Power supply voltage:
Device Specifications:
Equipment weight:
1600mm
6 pieces
Ø480*th100 mm
0-50 tr/min
0-8tr/min
0-50tr/min
80KW
3-phase 380V
1.9*2.8*H3.5 m
12T
- 产品描述
- Success Story
- Scope of Application
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- Commodity name: Double-sided (lapping) polishing machine DS1700
- Polishing disc outer diameter:: 1600mm
- Number of parade floats:: 6 pieces
- Maximum machining size:: Ø480*th100 mm
- Polishing pad speed:: 0-50 tr/min
- External gear rotational speed:: 0-8tr/min
- Internal gear rotational speed:: 0-50tr/min
- Installed power rating:: 80KW
- Power supply voltage:: 3-phase 380V
- Device Specifications:: 1.9*2.8*H3.5 m
- Equipment weight:: 12T
Product positioning
Ultra-large-scale mass-production double-sided lapping machine / Polished flagship model, DS The flagship model in the series is designed for high‑volume, double‑sided precision machining of large‑diameter wafers and oversized optical substrates. It is ideally suited for continuous mass production on semiconductor fabs and large‑scale optical manufacturing lines, while also supporting ultra‑high‑precision prototype development.
Product Features
Five motors independently control different mechanisms, driving the upper plate, lower plate, and central gear. ‑ Compound drive with an internal gear ring, programmable planetary motion trajectory; addresses the challenge of machining uniformity for large‑size workpieces, delivering excellent flatness consistency across large‑area disk surfaces; polishing disc. By employing a specially customized corrosion-resistant metal plate, we effectively circumvent the unique processing requirements of semiconductor materials and… CMP Requirements for the corrosion resistance of the process.
Closed-loop servo‑controlled pressurization system, oversized upper platen cylinder assembly, segmented pressure control for precise regulation, and fine adjustment of rotational speed and polishing‑fluid flow rate.
The entire machine features a full‑surface water‑cooling constant‑temperature circulation system, ensuring minimal temperature drift even during prolonged continuous operation on the large work surface, making it ideal for… 7 × 24 Hourly, continuous mass production.
High-capacity, multi-channel independent polishing‑slurry delivery ensures precise supply; multi‑pipe, zone‑based spraying allows for individual adjustment of flow rates across different areas, accommodating process variations at various locations on large‑diameter wafers.
Large touch screen PLC Control system capable of storing hundreds of proven process recipes, supporting production data recording and export, and compatible with factory environments. MES Docking; equipped with multiple safety interlocks and a safety protective enclosure door.
Extensive optional features: online thickness monitoring system, automated loading and unloading mechanisms, automatic plate‑repair unit, high‑precision micro‑pressure regulation, centralized waste‑liquid treatment system, and more; a fully customized automated production line is available.
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No. 39-13-8, Gangxing Street, Dalian Economic and Technological Development Zone, Liaoning Province
Dalian Somtec Industry Parts Co.,Ltd.
French Technology, French Quality
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