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Flexible Umbrella‑type High‑edge High‑throw Multi‑head Series M2S/3S800

keyword：

研磨

Polishing disc outer diameter:

Maximum machining size

Polishing disc rotational speed

Supporting rotational speed:

Arm swing rate:

Installed power rating:

Power supply voltage:

Device Specifications:

Equipment weight:

774mm

6 heads for wafer 200mm

0-140tr/min

0-55tr/min

0-50tr/min

5.6kw

380V three-phase

W1350*D1110*H2030

2000kg

category：

M2S/3S800

产品描述
Success Story
Scope of Application

Commodity name: Flexible Umbrella‑type High‑edge High‑throw Multi‑head Series M2S/3S800
Polishing disc outer diameter:: 774mm
Maximum machining size: 6 heads for wafer 200mm
Polishing disc rotational speed: 0-140tr/min
Supporting rotational speed:: 0-55tr/min
Arm swing rate:: 0-50tr/min
Installed power rating:: 5.6kw
Power supply voltage:: 380V three-phase
Device Specifications:: W1350*D1110*H2030
Equipment weight:: 2000kg

Product Positioning

Mass‑production high‑precision machine compatible with single‑side grinding and polishing for flat and curved surfaces. As a high‑end mainstream model for production lines, it performs single‑side fine grinding, mirror polishing and plate conditioning for workpieces larger than 2S/3S 320. It adapts to mass production of 8‑inch wafers and large‑size optical components, and supports both high‑precision R&D sample preparation and large‑scale mass‑production processing. The equipment can process large‑aperture high‑precision curved‑surface products and realize fast‑paced assembly‑line‑style mass‑production operations.

Three‑motor independent drive: upper umbrella‑type lifting multi‑head small‑diameter grinding and polishing discs, large‑diameter lower plate, spindle planet carrier for holding processed materials.

As a flexible umbrella‑type multi‑head series machine, it adopts three independently‑regulated motors with flexibly adjustable motion trajectories. It can process multiple workpieces of different specifications at the same time to achieve high production efficiency. For mass‑produced products with large processing aperture, small batch quantity and tight delivery schedule, it supports single‑workpiece‑per‑machine or multi‑workpiece‑per‑machine processing modes, which greatly reduces processing difficulty and costs, and effectively improves processing efficiency and accuracy.

Multi‑station cylinder micro‑pressure fine‑tuning grinding and polishing heads. Vacuum‑absorption tooling is optional; thin sheets and large‑size thin substrates can be carried by planet carriers. It features high‑precision pressure control and can process ultra‑high or ultra‑thick products of various apertures. The system allows independent single‑head control or synchronized multi‑head production.

Built‑in water‑cooled constant‑temperature system for polishing discs stabilizes plate temperature during long‑time continuous production and reduces surface profile drift.

Drip‑type precise polishing‑slurry supply with independent drip control for each head, greatly lowering polishing‑consumable costs. The pressure system is also equipped with matched per‑head independent control units. Experimental pressure can be finely tuned, and light‑pressure or heavy‑pressure settings can be configured freely.

Independent waste‑liquid collection and discharge structure.

Dual‑mode touch‑screen control system: manual commissioning mode for rapid sample trial‑run; automatic recipe mode capable of storing numerous mature process recipes for one‑click recall in mass‑production.

Multiple optional modules are supported: on‑line thickness monitoring, automatic unloading, constant‑temperature circulation, micro‑pressure adjustment and others. Customization is available based on production‑line requirements.

Specification	M2S 800/ M3S 800
Bowl size	825mm
Rotating tools	774mm
Max.Working Size	6 heads for wafer 200mm
Radius	R 1000+
Angle	0-20°
Plates rotation speed	0-140tr/min
Support rotation speed	0-55tr/min
Arm slew rate	0-50tr/min
Plates motor power	3.5kw
Arm motor power	0.9kw
Support motor power	0.9kw
Installed electrical power	5.6kw
Voltage	380V three-phase
Dimension	W1350D1110H2030
Weight	2000kg

Processable Materials
Fluorides, zinc selenide, zinc sulfide, lithium niobate, germanium, silicon, sapphire, various laser crystals, ceramics, infrared materials, optical glass, semiconductor materials and other soft, hard and brittle materials.
Main Applications:
Military industry, aerospace, electronics, semiconductors, laser navigation, machinery, medical treatment, optics, high‑end watch manufacturing, etc.