Home

Double-sided (lapping) polishing machine DS400

keyword：

研磨

Ultra-thin wafers, crystalline materials, high precision!

Rotating tools：

Number of carriers：

Max.Working Size：

Plates rotation speed：

Gear rotation speed：

Installed electrical power：

Voltage：

Specification of machine：

Weight：

380mm

5 pieces

Ø4 inches; thickness 30–100 mm

0-160tr/min

0-80tr/min

2.5kw

380V three-phase power

W1000*D800*H1880

600kg

category：

DS400

Description
Examples
Application

Commodity name: Double-sided (lapping) polishing machine DS400
Rotating tools：: 380mm
Number of carriers：: 5 pieces
Max.Working Size：: Ø4 inches; thickness 30–100 mm
Plates rotation speed：: 0-160tr/min
Gear rotation speed：: 0-80tr/min
Installed electrical power：: 2.5kw
Voltage：: 380V three-phase power
Specification of machine：: W1000*D800*H1880
Weight：: 600kg

Ultra-thin wafers, crystalline materials, high precision!

Product positioning

1 During the R&D phase, material development enables efficient and precise lapping and polishing of specialty materials—such as those with limited quantities, unstable properties, or characteristics like brittleness, softness, or hardness—as well as materials that demand stringent processing conditions. The double-sided machine platform supports both single- and double-sided processing for a wide range of materials.

2 Large-scale, mass-production double-sided lapping and polishing equipment; we undertake… DS280 Mass‑production models ranging from compact to larger formats are ideal for batch double‑sided lapping and polishing of small to medium‑size workpieces, seamlessly supporting both laboratory prototyping and continuous factory production. They serve as the mainstay of production lines. As high‑precision, dual‑side lapping and polishing systems, these machines offer user‑friendly operation, boost throughput, reduce staffing needs, and lower processing costs—while delivering exceptional accuracy in meeting stringent optical specifications and ensuring consistent, uniform mass‑produced parts on assembly‑line operations.

Product Features

Touchscreen control system, supporting manual adjustment and automatic recipe mode, with storage for multiple process recipes.

Expandable options

Optional modules include a constant-temperature cooling platter, polishing‑fluid circulation system, in‑line thickness positioning system, high‑precision micro‑pressure regulation, automatic material discharge, and an anti‑adhesion system.

Specifications	DS400
Bowl size	400mm
Rotating tools	380mm
Carriers track net	5 pcs* Ø 125mm
Max. Working Size	Ø4 inch ;th 30-100mm
Plates speed	0-160tr/min
Gear speed	0-80tr/min
Plates motor power	2 pcs * 0.9 kW
Gear motor power	0.6kw
Installed electrical power	2.5kw
Voltage	380V three-phase
Dimension	W1000D800H1880
Weight	600kg

Key words:

Polishing machine
equipment
system
lower platter
gear
rotational speed
motor
power
grinding
polishing disc

Double-sided polishing machine PV 0.027λ

Quartz crystal

2-inch double-sided polishing

1-inch double-sided polishing

Sapphire Ø40*30

Irregularly shaped crystal

Zinc sulfide Ø42.5*2.5

Quartz 90*40*0.15

Th: 0.01 mm

Blue glass 70*70*0.150

Attenuation ceramic Ø50*0.148

Quartz Ø50.8*0.103

Ceramic 56.25*56.25*0.15

YAG 60*60*0.275

Laser crystal

Optical material 10*10

Laser crystal

KDP, Mohs hardness 2.5

Sapphire

Glass sphere Ø2

Brewster Point
Processable materials:
Fluorides, zinc selenide, zinc sulfide, lithium niobate, germanium, silicon, sapphire, various laser crystals, ceramics, infrared materials, optical glass, semiconductor materials, and other soft, hard, and brittle substances.

Mainly used for:
Military industry, aerospace, electronics, semiconductors, laser navigation, machinery, medical devices, optics, and high-end watch manufacturing...