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Double-sided (lapping) polishing machine DS580

keyword：

研磨

Low cost, high efficiency, and excellent stability.

Rotating tools：

Number of carriers：

Max.Working Size：

Plates rotation speed：

Gear rotation speed：

Installed electrical power：

Voltage：

Specification of machine：

Weight：

540mm

6 pieces

Ø8 inches; thickness 30–100 mm

0-160tr/min

0-80tr/min

2.5kw

380V three-phase power

W1190*D900*H2030

800kg

category：

DS580

Description
Examples
Application

Commodity name: Double-sided (lapping) polishing machine DS580
Rotating tools：: 540mm
Number of carriers：: 6 pieces
Max.Working Size：: Ø8 inches; thickness 30–100 mm
Plates rotation speed：: 0-160tr/min
Gear rotation speed：: 0-80tr/min
Installed electrical power：: 2.5kw
Voltage：: 380V three-phase power
Specification of machine：: W1190*D900*H2030
Weight：: 800kg

Low cost, high efficiency, and excellent stability.

Product positioning

1 During the R&D phase, material development enables efficient and precise lapping and polishing of challenging materials—such as those available in limited quantities, with unstable properties, or characterized by fragility, softness, or hardness—as well as materials that demand stringent processing conditions. The dual‑sided machine platform supports both single‑ and double‑sided processing of these specialized materials.

2 Large-scale, mass-production double-sided grinding and polishing equipment; we undertake… DS280 Mass‑production models ranging from compact to larger sizes are ideal for batch double‑sided grinding and polishing of small to medium‑sized workpieces, seamlessly bridging laboratory prototyping and continuous factory production. They serve as the workhorse of production lines. As high‑precision, dual‑side grinding and polishing systems, these machines offer user‑friendly operation, boost throughput, reduce staffing needs, and lower processing costs—while delivering exceptional accuracy in meeting stringent optical specifications and ensuring consistent, high‑quality output across assembly‑line production.

Product Features

Touchscreen control system, supporting manual adjustment and automatic recipe mode, with storage for multiple process recipes.

Expandable options

Optional modules include a constant-temperature cooling platter, polishing‑fluid circulation supply, an online thickness‑positioning system, high‑precision micro‑pressure regulation, automatic material discharge, and an anti‑adhesion system.

Specifications	DS580
Bowl size	580mm
Rotating tools	540mm
Carriers track net	6 pcs* Ø 170mm
Max. Working Size	Ø8 inch ;th 30-100mm
Plates speed	0-160tr/min
Gear speed	0-80tr/min
Plates motor power	2 pcs * 0.9 kW
Gear motor power	0.6kw
Installed electrical power	2.5kw
Voltage	380V three-phase
Dimension	W1190D900H2030
Weight	800kg

Key words:

Polishing machine
equipment
system
lower platter
gear
rotational speed
motor
power
grinding
polishing disc

Processable materials:
Fluorides, zinc selenide, zinc sulfide, lithium niobate, germanium, silicon, sapphire, various laser crystals, ceramics, infrared materials, optical glass, semiconductor materials, and other soft, hard, and brittle substances.

Mainly used for:
Military industry, aerospace, electronics, semiconductors, laser navigation, machinery, medical devices, optics, and high-end watch manufacturing...