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Double-sided (lapping) polishing machine DS700

keyword：

研磨

Simple operation, excellent uniformity, and high yield.

Rotating tools：

Number of carriers：

Max.Working Size：

Plates rotation speed：

Gear rotation speed：

Installed electrical power：

Voltage：

Specification of machine：

Weight：

650mm

5 pieces

Ø8 inches; thickness 30–100 mm

0-200tr/min

0-60tr/min

13kw

380V three-phase power

W1350*D1110*H2030

2500kg

category：

DS700

Description
Examples
Application

Commodity name: Double-sided (lapping) polishing machine DS700
Rotating tools：: 650mm
Number of carriers：: 5 pieces
Max.Working Size：: Ø8 inches; thickness 30–100 mm
Plates rotation speed：: 0-200tr/min
Gear rotation speed：: 0-60tr/min
Installed electrical power：: 13kw
Voltage：: 380V three-phase power
Specification of machine：: W1350*D1110*H2030
Weight：: 2500kg

Simple operation, excellent uniformity, and high yield.

Product positioning

1 During the R&D phase, material development enables efficient and precise lapping and polishing of challenging materials—such as those available in limited quantities, with unstable properties, or characterized by fragility, softness, or hardness—as well as materials that demand stringent processing conditions. The dual‑sided machine platform supports both single‑ and double‑sided processing of these specialized materials.

2 Large-scale, mass-production double-sided lapping and polishing equipment; we undertake… DS280 Mass‑production models ranging from compact to larger sizes are ideal for batch double‑sided lapping and polishing of small to medium‑sized workpieces, seamlessly supporting both laboratory prototyping and continuous factory production. They serve as the primary high‑volume machines on the production line. As dual‑side, high‑precision lapping and polishing equipment, these systems offer ease of operation, boost throughput, reduce staffing needs, and lower processing costs—while delivering exceptional accuracy in meeting stringent optical specifications and ensuring consistent, uniform mass‑produced parts on a streamlined assembly line.

Product Features

Touchscreen control system, supporting manual adjustment and automatic recipe mode, with storage for multiple process recipes.

Expandable options

Optional modules include a constant-temperature cooling platter, polishing‑fluid circulation system, in‑line thickness positioning system, high‑precision micro‑pressure regulation, automatic material discharge, and an anti‑adhesion system.

Specifications	DS700
Bowl size	700mm
Rotating tools	650mm
Carriers track net	5 pcs* Ø215 mm
Max. Working Size	Ø8 inch ;th 30-100mm
Plates speed	0-200tr/min
Gear speed	0-60tr/min
Plates motor power	2 pcs × 5.5 kW
Gear motor power	0.9kw
Installed electrical power	13kw
Voltage	380V three-phase
Dimension	W1350D1110H2030
Weight	2500kg

Key words:

Polishing machine
system
equipment
optional accessories
power
dimensions
polishing
rotational speed
cycle
grinding
polishing pad

Processable materials:
Fluorides, zinc selenide, zinc sulfide, lithium niobate, germanium, silicon, sapphire, various laser crystals, ceramics, infrared materials, optical glass, semiconductor materials, and other soft, hard, and brittle substances.

Mainly used for:
Military industry, aerospace, electronics, semiconductors, laser navigation, machinery, medical devices, optics, and high-end watch manufacturing...