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Single‑axis Plane/Curved High polishing and high finishing Compatible with various models 2S/3S320

keyword：

研磨

Diversified processing products and customized equipment functions

Rotating tools：

Max.Working Size

Plates rotation speed：

Arm slew rate

Installed electrical power：

Voltage：

Specification of machine：

Weight：

300mm

Ø10 inch；th 100mm

0-650 tr/min

0-50 °/min

1.8kw

220V one-phase

W680*D950*H1930

150kg

category：

2S/3S320

Description
Examples
Application

Commodity name: Single‑axis Plane/Curved High polishing and high finishing Compatible with various models 2S/3S320
Rotating tools：: 300mm
Max.Working Size: Ø10 inch；th 100mm
Plates rotation speed：: 0-650 tr/min
Arm slew rate: 0-50 °/min
Installed electrical power：: 1.8kw
Voltage：: 220V one-phase
Specification of machine：: W680*D950*H1930
Weight：: 150kg

Diversified processing products and customized equipment functions

Product Positioning

High‑speed desktop single‑axis integrated high‑precision lapping and polishing machine for flat and curved surfaces. It can be integrated into production lines with DS‑series double‑sided machines. Focused on sample R&D and high‑speed, high‑precision processing of high‑volume flat and curved‑surface products, it is widely used for single‑side fine lapping and high‑gloss polishing of optics, laser crystals and semiconductor substrates, as well as high‑speed lapping and polishing of custom high‑precision curved‑surface parts.

Product Features

Dual‑mode speed regulation: Supports constant rotational speed and constant linear speed modes for improved polishing consistency of large‑size workpieces.
Dual‑operation levels: Simplified manual mode for rapid trial lapping; automatic recipe mode stores multiple sets of process parameters to help technicians standardize processes.
Flexible networking: Capable of standalone production and sample prototyping, as well as mass production via multi‑unit parallel connection. Often matched with DS‑series double‑sided machines to complete three processes in one production line: double‑sided lapping, single‑side fine polishing and polishing plate dressing.
Vertical compact desktop structure with small footprint, suitable for deployment in laboratories and clean‑room workshops. Broad compatibility: The machine supports processing of various high‑precision flat single‑sided products and curved‑surface parts.

Equipment parameters

Plane

Curved Surface

Model

2S 320

Model

3S 320

Function

Correction

Lapping

Polishing

Function

Correction

Lapping

Polishing

Specification	320
Bowl size	320mm
Rotating tools	200mm
Max.Working Size	Ø10 inch；th 100mm
R Radius	R 1000+
Angle	0-90°
Plates rotation speed	0-650 tr/min
Arm slew rate	0-50 °/min
Plates motor power	0.6kw
Arm motor power	0.9kw
Installed electrical power	1.8kw
Voltage	220V single phase
Dimension	W500D820H1930
Weight	150kg

Key words:

polishing
lapping
SS320

Processing material range：

Fluoride, zinc selenide, zinc sulfide, lithium niobate, lithium carbonate, germanium, silicon and other crystals, ceramics, sapphire, infrared, semiconductor, laser, metal, precision optical devices and ordinary glass......

Application：

Military industry, aerospace, electronics, semiconductor, laser navigation, machinery, medical treatment, optics, high-end watch manufacturing......